AG Termo Thermal Adhesive Glue 10g

The AG Termo Thermal Adhesive Glue (10g) is a high-performance thermally conductive adhesive designed for attaching heatsinks to electronic components. It ensures efficient heat transfer while providing a strong and durable bond.

Key Features:

• Thermal Conductivity: Enables effective heat dissipation for improved component cooling.
• Temperature Resistance: Operates in high temperatures up to 200°C.
• Quick Drying: Surface drying occurs within minutes, with full curing in 24 to 48 hours.
• Strong Adhesion: Provides a secure bond between components and heatsinks.
• Easy Application: Comes in a 10g syringe for precise and controlled use.
• White Color: Helps in visibility and even application.

Usage Instructions:

1. Prepare the Surface: Ensure both surfaces are clean and dry.
2. Apply the Adhesive: Spread a thin, even layer (up to 6mm).
3. Press and Hold: Join the components together and apply light pressure.
4. Allow to Cure: Let it dry for the recommended time for maximum strength.